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Homepage>CSN EN 60191-6-4 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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Released: 2003
CSN EN 60191-6-4 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

CSN EN 60191-6-4

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 60191-6-4
Category:358791
Released:2003
DESCRIPTION

EN 60191-6-4


EN 60191-6-4 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) - Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.