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Homepage>CSN EN 60749-19 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Released: 2003
CSN EN 60749-19 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

CSN EN 60749-19

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 60749-19
Category:358799
Released:2003
DESCRIPTION

EN 60749-19


EN 60749-19 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength - Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.