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CSN EN 60749-19
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
|Number of Standard:||CSN EN 60749-19|
EN 60749-19 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength - Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.