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Homepage>CSN EN 60749-22 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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Released: 2003
CSN EN 60749-22 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

CSN EN 60749-22

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 60749-22
Category:358799
Released:2003
DESCRIPTION

EN 60749-22


EN 60749-22 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength - Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.