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Homepage>CSN EN 61192-2 - Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
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Released: 2003
CSN EN 61192-2 - Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

CSN EN 61192-2

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 61192-2
Category:359042
Released:2003
DESCRIPTION

EN 61192-2


EN 61192-2 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies - Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.