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CSN EN 61192-3
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS
|Number of Standard:||CSN EN 61192-3|
EN 61192-3 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS - Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Original English text of CSN EN Standard.
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