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Homepage>CSN EN 61192-3 - Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS
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Released: 2003
CSN EN 61192-3 - Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS

CSN EN 61192-3

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 61192-3
Category:359042
Released:2003
DESCRIPTION

EN 61192-3


EN 61192-3 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS - Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.