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Homepage>CSN EN 62418 - Semiconductor devices - Metallization stress void test (IEC 62418:2010)
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Released: 2010
CSN EN 62418 - Semiconductor devices - Metallization stress void test (IEC 62418:2010)

CSN EN 62418

Semiconductor devices - Metallization stress void test (IEC 62418:2010)

CURRENCY
LANGUAGE
English
Number of Standard:CSN EN 62418
Category:358772
Released:2010
DESCRIPTION

EN 62418


EN 62418 Semiconductor devices - Metallization stress void test (IEC 62418:2010) - IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.